ISO 9453:2014 specifies the requirements for chemical composition for soft solder alloys containing two or more of tin, lead, antimony, copper, silver, bismuth, zinc, indium and/or cadmium.
Revises
ISO 9453:2006
WITHDRAWN
ISO 9453:2014
95.99
Withdrawal of Standard
Sep 24, 2020
PUBLISHED
ISO 9453:2020
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