ISO 9453:2006 specifies the requirements for chemical composition for the following families of soft solder alloys:
tin-lead, with and without antimony, bismuth, cadmium, copper, and silver;tin-antimony;tin-bismuth;tin-copper, with and without silver;tin-indium, with and without silver and bismuth;tin-silver, with and without copper and bismuth;tin-zinc, with and without bismuth.
ISO 9453:2006 also includes an indication of the forms generally available.
Revises
ISO 9453:1990
WITHDRAWN
ISO 9453:2006
95.99
Withdrawal of Standard
Aug 18, 2014
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