ISO 9453:2020

Soft solder alloys — Chemical compositions and forms

Publication date: Sep 24, 2020

General information

Current stage: 60.60 Effective date: Sep 24, 2020

Originator: ISO

Owner: ISO/TC 44/SC 12

Type: International Standard

ICS: 25.160.50

Languages: English French

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Status: Published

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Scope

This document specifies the requirements for chemical composition for soft solder alloys containing two or more of: tin, lead, antimony, copper, silver, bismuth, zinc, indium and/or cadmium.
An indication of the forms generally available is also included.

Life cycle

PREVIOUSLY

Revises
ISO 9453:2014

NOW

PUBLISHED
ISO 9453:2020
60.60 Standard published
Sep 24, 2020

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