ISO/TS 10303-1689:2018

Industrial automation systems and integration — Product data representation and exchange — Part 1689: Application module: Interconnect physical requirement allocation

Publication date: Dec 18, 2018

General information

Current stage: 90.60 Effective date: Mar 14, 2022

Originator: ISO

Owner: ISO/TC 184/SC 4

Type: Technical Specification

ICS: 25.040.40

Languages: English

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Status: Published

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Paper - EC$183.61

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Scope

ISO/TS 10303-1689:2018-11 specifies the application module for
Interconnect physical requirement allocation.

The following are within the scope of
ISO/TS 10303-1689:2018-11:

thermal isolation requirement definition;electrical isolation requirement definition;thermal isolation template for substrate design;electrical isolation template for substrate design;length tolerance on spacing requirement;allocation of an isolation requirement to a shield realized as part of an interconnect substrate.

Life cycle

PREVIOUSLY

Revises
ISO/TS 10303-1689:2014

NOW

PUBLISHED
ISO/TS 10303-1689:2018
90.60 Close of review
Mar 14, 2022

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