ISO/TS 10303-1689:2014-02 specifies the application module for
Interconnect physical requirement allocation.
The following are within the scope of
ISO/TS 10303-1689:2014-02:
thermal isolation requirement definition;electrical isolation requirement definition;thermal isolation template for substrate design;electrical isolation template for substrate design;length tolerance on spacing requirement;allocation of an isolation requirement to a shield realized as part of an interconnect substrate.
Revises
ISO/TS 10303-1689:2010
WITHDRAWN
ISO/TS 10303-1689:2014
95.99
Withdrawal of Standard
Dec 18, 2018
PUBLISHED
ISO/TS 10303-1689:2018
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