ISO/TS 10303-1688:2010-03 specifies the application module for
Interconnect non planar shape.
The following are within the scope of
ISO/TS 10303-1688:2010-03:
three dimensional manifold surface representation of an interconnect substrate;placement of footprint and other planar feature definitions in a three dimensional manifold surface representation
including changing the planar shape to a manifold shape.
Revises
ISO/TS 10303-1688:2006
PUBLISHED
ISO/TS 10303-1688:2010
90.60
Close of review
Mar 5, 2021
Only informative sections of projects are publicly available. To view the full content, you will need to members of the committee. If you are a member, please log in to your account by clicking on the "Log in" button.