ISO/TS 10303-1688:2006 specifies the application module for
Interconnect non planar shape.
The following are within the scope of
ISO/TS 10303-1688:2006:
three dimensional manifold surface representation of an interconnect substrate;placement of footprint and other planar feature definitions in a three dimensional manifold surface representation
including changing the planar shape to a manifold shape.
WITHDRAWN
ISO/TS 10303-1688:2006
95.99
Withdrawal of Standard
May 18, 2010
PUBLISHED
ISO/TS 10303-1688:2010
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