ISO/DIS 9455-17

Soft soldering fluxes — Test methods — Part 17: Surface insulation resistance comb test and electrochemical migration test of flux residues

General information

Current stage: 40.20 Effective date: Aug 1, 2022

Originator: ISO

Owner: ISO/TC 44/SC 12

Type: International Standard

ICS: 25.160.50

Languages: English French

Buying

Status: Draft

PDF - EC$183.61

Paper - EC$183.61

PDF and Paper - EC$367.22

Language

Language in which you want to receive the document.

Scope

ISO 9455-17:2002 specifies a method of testing for deleterious effects that may arise from flux residues after soldering or tinning test coupons. The test is applicable to type 1 and type 2 fluxes in solid or liquid form, or in the form of flux-cored solder wire, solder preforms or solder paste constituted with eutectic or near-eutectic tin/lead solders.
This test method is also applicable to fluxes for use with lead-free solders. However, the soldering temperatures may be adjusted with agreement between tester and customer.

Life cycle

PREVIOUSLY

Revises
ISO 9455-17:2002

NOW

IN_DEVELOPMENT
ISO/DIS 9455-17
40.20 DIS ballot initiated: 12 weeks
Aug 1, 2022

Preview

Only informative sections of projects are publicly available. To view the full content, you will need to members of the committee. If you are a member, please log in to your account by clicking on the "Log in" button.