ISO/AWI 9455-18

Soft soldering fluxes — Test methods — Part 18: Part 18: Test methods of cleanliness of the Soldered Printed Circuit Assemblies before and/or after cleaning

General information

Current stage: 20.00 Effective date: Sep 15, 2021

Originator: ISO

Owner: ISO/TC 44/SC 12

Type: International Standard

Scope

This part of ISO 9455 specifies test methods of cleanliness of the Soldered Printed Circuit Assemblies before and/or after cleaning. The test is applicable to all fluxes as defined in ISO 9454-1.

Life cycle

NOW

IN_DEVELOPMENT
ISO/AWI 9455-18
20.00 New project registered in TC/SC work programme
Sep 15, 2021

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