ISO/TS 10303-1716:2018

Industrial automation systems and integration — Product data representation and exchange — Part 1716: Application module: Layered interconnect complex template

Publication date: Dec 18, 2018

General information

Current stage: 90.93 Effective date: Aug 7, 2022

Originator: ISO

Owner: ISO/TC 184/SC 4

Type: Technical Specification

ICS: 25.040.40

Languages: English

Buying

Status: Published

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Paper - EC$183.61

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Scope

ISO/TS 10303-1716:2018-11 specifies the application module for
Layered interconnect complex template.

The following are within the scope of
ISO/TS 10303-1716:2018-11:

footprint definition;
footprint definition shape;
padstack definition;
padstack definition shape;
items within the scope of application module Layered interconnect simple template, ISO/TS 10303-1718;
items within the scope of application module Physical unit 2d shape, ISO/TS 10303-1726.

Life cycle

PREVIOUSLY

Revises
ISO/TS 10303-1716:2014

NOW

PUBLISHED
ISO/TS 10303-1716:2018
90.93 Standard confirmed
Aug 7, 2022

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