ISO/TS 10303-1698:2018

Industrial automation systems and integration — Product data representation and exchange — Part 1698: Application module: Layered interconnect module design

Publication date: Dec 18, 2018

General information

Current stage: 90.60 Effective date: Mar 14, 2022

Originator: ISO

Owner: ISO/TC 184/SC 4

Type: Technical Specification

ICS: 25.040.40

Languages: English

Buying

Status: Published

PDF - EC$183.61

Paper - EC$183.61

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Scope

ISO/TS 10303-1700:2018-11 specifies the application module for
Layered interconnect module with printed component design.

The following are within the scope of
ISO/TS 10303-1700:2018-11:

printed components;
routed printed components;
printed connectors;
items within the scope of application module Land, ISO/TS 10303-1692;
items within the scope of application module Printed physical layout template, ISO/TS 10303-1737.

Life cycle

PREVIOUSLY

Revises
ISO/TS 10303-1698:2014

NOW

PUBLISHED
ISO/TS 10303-1698:2018
90.60 Close of review
Mar 14, 2022

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