Published
ISO/TS 10303-1650:2018-11 specifies the application module for
Bare die.
The following is within the scope of
ISO/TS 10303-1650:2018-11:
The
representation of the information needed to describe a semiconductor material product
that is an integrated circuit component, or that may be a discrete active component,
or that may be included as a component in an electronic assembly.
Terminal information is supported, including explicit shape data.
A bare die usually refers to semiconductor substrates that are traditionally considered protected by a container, called
a package.
definition of the minimum content model of an interface control definition of a bare die, including its terminals, behavioural
simulation model, and shape.
Revises
ISO/TS 10303-1650:2014
PUBLISHED
ISO/TS 10303-1650:2018
90.93
Standard confirmed
Aug 4, 2022
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