ISO 9455-14:2017

Soft soldering fluxes — Test methods — Part 14: Assessment of tackiness of flux residues

Publication date: Aug 17, 2017

General information

Current stage: 90.93 Effective date: Jan 4, 2023

Originator: ISO

Owner: ISO/TC 44/SC 12

Type: International Standard

ICS: 25.160.50

Languages: English French

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Status: Published

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Scope

ISO 9455-14:2017 specifies a qualitative method for the assessment of the tackiness of the residues of a soft soldering flux after a soldering process. The method is applicable to all fluxes, solder pastes and flux cored solder wires. The method is particularly appropriate for applications where flux residues are left in situ on electrical and electronic equipment.

Life cycle

PREVIOUSLY

Revises
ISO 9455-14:1991

NOW

PUBLISHED
ISO 9455-14:2017
90.93 Standard confirmed
Jan 4, 2023

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