ISO/TS 10303-1685:2014-02 specifies the application module for
Interconnect module to assembly module relationship.
The following are within the scope of
ISO/TS 10303-1685:2014-02:
assembly requirement for interconnect substrate;assembly component based symbol placement in substrate requirement;assembly component based annotation text placement in substrate requirement;assembly component feature to layout feature requirement relationship;external references for assembly component;external references for assembly component feature;
Revises
ISO/TS 10303-1685:2010
WITHDRAWN
ISO/TS 10303-1685:2014
95.99
Withdrawal of Standard
Dec 18, 2018
PUBLISHED
ISO/TS 10303-1685:2018
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