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ISO/TS 10303-1650:2010

Industrial automation systems and integration — Product data representation and exchange — Part 1650: Application module: Bare die

95.99 Withdrawal of Standard   Nov 18, 2014

General information

95.99     Nov 18, 2014

ISO

ISO/TC 184/SC 4

Technical Specification

25.040.40  

Scope


ISO/TS 10303-1650:2010-03 specifies the application module for
Bare die.



The following is within the scope of
ISO/TS 10303-1650:2010-03:



The
representation of the information needed to describe a semiconductor material product
that is an integrated circuit component, or that may be a discrete active component,
or that may be included as a component in an electronic assembly.
Terminal information is supported, including explicit shape data.
A bare die usually refers to semiconductor substrates that are traditionally considered protected by a container, called
a package.

definition of the minimum content model of an interface control definition of a bare die, including its terminals, behavioural
simulation model, and shape.

Life cycle

PREVIOUSLY

Revises
ISO/TS 10303-1650:2006

NOW

WITHDRAWN
ISO/TS 10303-1650:2010
95.99 Withdrawal of Standard
Nov 18, 2014

REVISED BY

WITHDRAWN
ISO/TS 10303-1650:2014

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