ISO/TS 10303-1741:2006 specifies the application module for
Sequential laminate assembly design.
The following are within the scope of
ISO/TS 10303-1741:2006:
sequence of application of an embedded component;
sequence of material buildup or lamination;
support for embedded component location;
items within the scope of application module Assembly module with interconnect component, ISO/TS 10303-1643;
items within the scope of application module Layered interconnect module design, ISO/TS 10303-1698.
WITHDRAWN
ISO/TS 10303-1741:2006
95.99
Withdrawal of Standard
May 18, 2010
WITHDRAWN
ISO/TS 10303-1741:2010
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